In order to address successfully this is issue is by seeing manufacturability by Design For Manufacturability (DFM). DFM set design guidelines would consider the processes and capabilities of the manufacturing industry.
Engineering errors often experienced:
Designing your boards without prior knowledge of the manufacturer PCB capabilities and capacities.
Not researching and/or not updating one’s list of new and existing material available since many primary natural resources are finite and can be less accessible.
Flex, High speed, RF, High temp & RoHS boards can all have different materials and each material can be made by a different manufacturer with slightly different specifications. Lead time on some special materials can be several weeks. The idea is to choose the material that fits your needs more closely and is more accessible at a reasonable cost.
Lack of detailed stack up information from fabricators in the board designing process.
Every manufacturing facility has different manufacturing tolerances that can affect the target impedance and/or stack up. When you design your board without consulting with your PCB suppliers, adjustments may need to be made in order to certify to your impedance requirements. This may increase the lead time and the cost, if special order material is necessary to make the adjustments. Have the stack up provided by your PCB suppliers before proceeding with your design.
A common mistake is setting up the plane layers with the same requirements as signal layers.
This would add unnecessary difficulty to the Printed Circuit Board and potential yield issues, and as a result, increased overall costs.
The prepared data package does not include an IPC-356A net list.
The IPC-356A net list allows the PCB supplier to find errors in the design by comparing the gerbers to the CAD database. It’s possible files contained errors or were previously corrupted. Without a net list, many of them cannot be caught.
Contact us to discuss how to achieve the best results with your Printed Circuit Board project and specs.
We will be happy to provide our professional advice on the technology that you require to manufacture your Printed Circuit Boarfds in the most economical way.
Here at Giltronics Associates we can consult with you on material, stack up, copper weight, final finish, filled vias, stack vias, blind and buried vias, drill to copper requirements and any other aspect of your project from beginning to end. To speak to someone regarding any of your requirements and simply to get a technical answer, call or contact us here